AM5 開蓋:AMD Zen4 桌上型IHS照片曝光 - 3C

By Selena
at 2022-06-08T19:04
at 2022-06-08T19:04
Table of Contents
TechPowerUp報導稱AMD即將推出的Zen4桌上型CPU
似乎已經提前流入某個超頻玩家的手中。
如下圖所示照片展示了AM5 CPU散熱頂蓋(IHS)的內部結構
表明其在基板上整合了一個IOD和兩組Zen4 CCD 。
與之前看過的CPU頂蓋相比,AM5 IHS顯得厚實了不少
但鑑於這位超頻玩家的開蓋經驗相當純熟
想看到被釬焊的幾個小晶片似乎也並非難事
此外TechPowerUp指出與目前採用的牢固密封設計的CPU不同
Zen4桌上型處理器似乎僅在少數幾個晶片位置上蜻蜓點水意思了幾下。
通常情況下晶片製造商會在IHS 上塗有一些界面材料
以改善焊接的效果。至於本次破拆是否導致晶片本體損傷
或者只是釬焊材料留在CPU頂蓋上,目前暫不得而知。
https://www.cnbeta.com/articles/tech/1278485.htm
XF編譯
https://www.xfastest.com/thread-263011-1-1.html
https://i.imgur.com/NrJPMXT.jpg

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