AMD 16核32線程Ryzen發燒版Intel徹底慌了 - 3C

By Hardy
at 2017-03-20T14:29
at 2017-03-20T14:29
Table of Contents
AMD Ryzen處理器在桌面上最多有8核心16執行緒,對手最高定位是Intel發燒級次旗艦
同樣8核心16執行緒的Core i7-6900K,等於直接放過了最頂級的10核心20執行緒Core
i7-6950X。
只有到了伺服器領域,Zen架構才會做得更大,直接做到32核心64執行緒。
但是,8核心到32核心,這中間的跨度是不是太大了點?
最新消息稱,AMD也在秘密研發自己的發燒級桌面平臺,通過雙Die整合封裝的方式(俗稱
膠水)
將兩顆Ryzen 7處理器堆到一起,從而得到16核心32核心,DDR4記憶體通道也因此翻番為4
個
並且可以擁有更充裕的PCI-E通道。
據爆料,這種發燒Ryzen將採用新的Socket SP3r2封裝介面(早先卻是有此介面的傳聞)
熱設計功耗大約150W,為此主頻不得不做一些犧牲,只有2.4-2.8GHz。
有趣的是,這套平臺也會有新的晶片組,命名為X399——
Intel下代發燒平臺晶片組叫X299,後路再次被堵死。
來源︰http://news.mydrivers.com/1/524/524188.htm
Intel 嚇到即將拿出 7950X 跟 7900K
還有 Purley 平台來應戰先
6 通道記憶體、48 條PCIe GEN3
--
同樣8核心16執行緒的Core i7-6900K,等於直接放過了最頂級的10核心20執行緒Core
i7-6950X。
只有到了伺服器領域,Zen架構才會做得更大,直接做到32核心64執行緒。
但是,8核心到32核心,這中間的跨度是不是太大了點?
最新消息稱,AMD也在秘密研發自己的發燒級桌面平臺,通過雙Die整合封裝的方式(俗稱
膠水)
將兩顆Ryzen 7處理器堆到一起,從而得到16核心32核心,DDR4記憶體通道也因此翻番為4
個
並且可以擁有更充裕的PCI-E通道。
據爆料,這種發燒Ryzen將採用新的Socket SP3r2封裝介面(早先卻是有此介面的傳聞)
熱設計功耗大約150W,為此主頻不得不做一些犧牲,只有2.4-2.8GHz。
有趣的是,這套平臺也會有新的晶片組,命名為X399——
Intel下代發燒平臺晶片組叫X299,後路再次被堵死。
來源︰http://news.mydrivers.com/1/524/524188.htm
Intel 嚇到即將拿出 7950X 跟 7900K
還有 Purley 平台來應戰先
6 通道記憶體、48 條PCIe GEN3
--
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3C
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