AMD Zen3 Ryzen 5000系列APU核心結構曝光 - 3C
By Gilbert
at 2021-01-08T00:02
at 2021-01-08T00:02
Table of Contents
VideoCardz剛剛分享了AMD Zen3 Ryzen 5000“Cezanne”系列APU的核心結構圖
可知其規模較上一代Zen2 Ryzen 4000“Renoir”APU有相當大的改進
此外由早前曝光的測試成績可知得益於統一的L3快取等架構升級
採用台積電7nm增強型製程的Zen3產品在IPC和能效方面都迎來了大幅度的提升。
據悉桌上型和行動平台的Ryzen 5000 系列CPU/APU都會採用Zen 3“Cezanne”架構
下週我們還有望在CES 2021期間見證它在行動平台上的實際表現
各大OEM合作夥伴都已經準備好了推出Zen3 Ryzen 5000H標壓和5000U低功耗處理器的機型
且有望搭配NVIDIA的旗艦GeForce RTX行動GPU 。
規格方面Zen3 Ryzen 5000系列CPU提供多達8核/16線程的設計，輔以4MB L2+16MB L3快取
且整合8組CU/512核的增強型Vega GPU。作為對比Ryzen 4000“Renoir”處理器的兩組CCD
只能分別訪問8MB的L3
這顯然嚴重限制了晶片的整體CPU/GPU性能。
此外從圖片來看Ryzen 5000 Cezanne核心規模（約175 m㎡）也較Ryzen 4000 Renoir（
156 m㎡）大一些
增加了大約20 m㎡ 。如果一切順利的話AMD將在CES 2021的主題演講期間隆重介紹
Cezanne-H CPU
包括早期洩漏的R9-5900H和R6-5900HX型號。至於競爭對手Intel那邊的Tiger Lake-H在筆
記型市場有怎樣的表現
還請耐心等待即將於2021年1季上演的精彩對戰。
來源
XF編譯
https://www.xfastest.com/thread-247302-1-1.html
好 老規矩 跟4000一樣 但不單賣 限組整台 不單出
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