您是否被 H M U Y Processor 搞的頭昏眼花呢？ 下面簡單列出一些不同點
Mobile 4th Generation Intel® Processor Family (Traditional, 2-chip)
Package Specifications:
Ball Grid Array (BGA) , 1364 Pins, for H-Processor Line w/ GT3 or GT2.
Reduced Pin Grid Array (rPGA), 946 Pins, for M-Processor Line w/ GT2 or GT1.
Processor DIMM Support:
Dual Core: 1 DIMM Per Channel, dual-channel Maximum.
Quad Core: 2 DIMM Per Channel, dual-channel Maximum.
Thermal Design Power (TDP) Specifications:
57W Quad Core rPGA Processor with GT2 Graphics (M-Processor) (XE)
47W Quad Core BGA Processor with GT3 Graphics (H-Processor)
47W Quad Core BGA Processor with GT2 Graphics (H-Processor)
47W Dual Core BGA Processor with GT2 Graphics (H-Processor)
47W Quad Core rPGA Processor with GT2 Graphics (M-Processor)
37W Quad Core BGA Processor with GT2 Graphics (H-Processor)
37W Quad Core rPGA Processor with GT2 Graphics (M-Processor)
37W Dual Core rPGA Processor with GT2/GT1 Graphics (M-Processor)
Mobile 4th Generation Intel® Processor Family (ultrabook, 1-chip)
Package Specifications:
Ball Grid Array (BGA) , 1168 Pins, for U-Processor and Y-Processor Line
Processor DIMM Support:
1 DIMM Per Channel, dual-channel Maximum.
Thermal Design Power (TDP) Specifications:
28W U-Processor (Dual Core) with GT3 Graphics
15W U-Processor (Dual Core) with GT3 Graphics
15W U-Processor (Dual Core) with GT2 Graphics
11.5W Y-Processor (Dual Core) with GT1 or GT2 Graphics
結論都是 Mobile 的處理器....
補充: 記得看一下這篇 能夠了解8種 haswell 的封裝方式
IntelがHaswellの設計詳細をHot Chipsで発表
http://pc.watch.impress.co.jp/docs/column/kaigai/20130904_613951.html
References:
Mobile 4th Generation Intel® Core™ Processor Family, Mobile Intel® Pentium® Processor Family, and Mobile Intel® Celeron® Processor Family - External Design Specification (EDS) - Volume 1 of 2 - Rev. 2.3v1
Mobile 4th Generation Intel® Core™ Processor Family, Mobile Intel® Pentium® Processor Family, and Mobile Intel® Celeron® Processor Family - External Design Specification (EDS) Volume 1 of 2 - Rev. 2.3
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Mobile 4th Generation Intel® Processor Family (Traditional, 2-chip)
Package Specifications:
Ball Grid Array (BGA) , 1364 Pins, for H-Processor Line w/ GT3 or GT2.
Reduced Pin Grid Array (rPGA), 946 Pins, for M-Processor Line w/ GT2 or GT1.
Processor DIMM Support:
Dual Core: 1 DIMM Per Channel, dual-channel Maximum.
Quad Core: 2 DIMM Per Channel, dual-channel Maximum.
Thermal Design Power (TDP) Specifications:
57W Quad Core rPGA Processor with GT2 Graphics (M-Processor) (XE)
47W Quad Core BGA Processor with GT3 Graphics (H-Processor)
47W Quad Core BGA Processor with GT2 Graphics (H-Processor)
47W Dual Core BGA Processor with GT2 Graphics (H-Processor)
47W Quad Core rPGA Processor with GT2 Graphics (M-Processor)
37W Quad Core BGA Processor with GT2 Graphics (H-Processor)
37W Quad Core rPGA Processor with GT2 Graphics (M-Processor)
37W Dual Core rPGA Processor with GT2/GT1 Graphics (M-Processor)
Mobile 4th Generation Intel® Processor Family (ultrabook, 1-chip)
Package Specifications:
Ball Grid Array (BGA) , 1168 Pins, for U-Processor and Y-Processor Line
Processor DIMM Support:
1 DIMM Per Channel, dual-channel Maximum.
Thermal Design Power (TDP) Specifications:
28W U-Processor (Dual Core) with GT3 Graphics
15W U-Processor (Dual Core) with GT3 Graphics
15W U-Processor (Dual Core) with GT2 Graphics
11.5W Y-Processor (Dual Core) with GT1 or GT2 Graphics
結論都是 Mobile 的處理器....
補充: 記得看一下這篇 能夠了解8種 haswell 的封裝方式
IntelがHaswellの設計詳細をHot Chipsで発表
http://pc.watch.impress.co.jp/docs/column/kaigai/20130904_613951.html
References:
Mobile 4th Generation Intel® Core™ Processor Family, Mobile Intel® Pentium® Processor Family, and Mobile Intel® Celeron® Processor Family - External Design Specification (EDS) - Volume 1 of 2 - Rev. 2.3v1
Mobile 4th Generation Intel® Core™ Processor Family, Mobile Intel® Pentium® Processor Family, and Mobile Intel® Celeron® Processor Family - External Design Specification (EDS) Volume 1 of 2 - Rev. 2.3
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