https://www.hardocp.com/article/2018/04/09/intel_rumors_kaby_lakex_skylakex_cascade_lake
https://goo.gl/7UQZ7k
We will see refreshes to the Skylake-X CPUs in late Q318 or early Q418. These
will stretch from 6 to 18 cores. The Skylake-X will not feature any
architecture changes. It will however be moving from PTIM (Polymer Thermal
Interface Material) to STIM (Solder Thermal Interface Material) for its
Integrated Heat Spreader connection. This seems to be a reaction to Intel
needing to keep pace with its tiny jumps in performance. Currently the STIM
parts are reaching for a +150MHz to +200MHz on base and turbo frequencies as
a result of the PTIM to STIM change. (Now if Intel would do this for its
"enthusiast" K-SKU parts!) Intel is looking to target bins pushing ~5GHz on
12 and 14 core parts (WOW!) with an estimated TDP range of 275w to 300w on
Socket R. This TDP bump will assuredly will require new VRM layouts on
motherboards, so we will see some new boards out to address these CPUs
specifically and it looks that SuperMicro is at the front of the pack on
that. SuperMicro tipped its hand to this at CES showing off 300W TDP support.
Cascade Lake-X 預計 2018 年 Q3~Q4發售，會改回焊錫。
12c 和 14c 可以上 5Ghz。不過 TDP 變成 275W ~ 300W
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