Intel 全新CPU:八代Core整合AMD顯示諜照 - 3C

By Lydia
at 2017-11-10T11:53
at 2017-11-10T11:53
Table of Contents
本週Intel官方宣布,將與AMD進行合作,在自家的CPU處理器中
整合AMD Radeon GPU圖形核心,為輕薄筆記型帶來真正的獨立顯示卡等級體驗
本次合作Intel拿出的是第八代Core高性能行動版Coffee Lake-H CPU
AMD則奉上了專門定制的Vega架構GPU,都是雙方的最新力作。
那麼,這款處理器究竟長什麼樣呢?外媒稍早時候公佈了一張諜照
這次曝光的諜照和此前的圖佈局相似,核心分為三大部分,左側應該是處理器,中間是
GPU核心
右側則應該是HBM2記憶體。雖然看起來只是膠水封裝,但這麼做的技術難度可不低
Intel重新設計了嵌入式多裸片互連橋接(EMIB),並沒有讓Vega GPU和HBM2走AMD自己的互
聯層。
Intel這麼做的好處就是能夠有效連接CPU、GPU和專用顯示記憶體,允許異構芯片在極其
接近時快速傳遞訊息
消除了高度、製造和設計複雜性的影響。首款採用這種Intel+AMD異構芯片的設備將在
2018年第一季問世
至於性能,傳聞CPU部分有望強於GTX 1050 Ti。
來源
http://www.cnbeta.com/articles/tech/668945.htm
XF編譯
http://www.xfastest.com/thread-202347-1-1.html
Intel 內顯 鹹魚翻身先從合作版本開始爬升
再來把無間道 臥底人員 Raja Koduri 回收回聘以後
就可以開始出Inte 自己版本的超強革命內顯
--
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3C
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