WD與Toshiba宣布128層3D NAND:單顆512Gb - 3C

By Wallis
at 2019-03-08T00:16
at 2019-03-08T00:16
Table of Contents
外媒報導稱WD和Toshiba已經開發出了128層@ 512Gbit容量的3D NAND(又稱TLC)
如果沿續此前的命名習慣,我們可以把它叫做BiCS-5 。因為BiCS-4為96層,BiCS-3為64
層。與BiCS-4顆粒相比
新技術額外多出的32層,能夠輕鬆將容量提升1/3、從而大幅降低製造同等容量終端產品
的成本。
相關產品有望在2020年末投產,並在2021年實現量產。據悉BiCS-5採用了陣列下電路(
CuA)設計
其中邏輯電路位於晶片的底部,數據層堆疊在它的上方。與非CuA 技術相比
晶片尺寸可縮小15% 。與96 層的BiCS-4 相比,BiCS-5 可讓模具總體縮小23% 。
將這部分空間釋放之後WD和Toshiba將能夠利用四平面(相較於傳統的雙平面)
將顆粒性能提升兩倍。模具將分為四個平面或部分,允許獨立或併行訪問,吞吐量可達
132MB/s
相比之下三星的110+層晶片,只有83MB/s 的吞吐量。
BiCS-5顆粒能夠在1.2Gb/s 的IO頻寬下執行,讀取延遲低至45 微秒
此外WD使用4KB頁面來訪問128層晶片上的數據,而不是行業傳統所限的16KB 標準頁面。
來源
https://www.cnbeta.com/articles/tech/825151.htm
XF編譯
https://www.xfastest.com/thread-226424-1-1.html
太好了 1TB 2TB SSD 爛大街時代快到了
TOSHIBA 1T 機械碟 藍標1T機械碟 退場吧
--
下吹名將︰SI-128、SI-128 SE
塔型空冷名將群 ︰
HR-01、HR-01 PLUS
Ultra120、Ultra120A、Ultra120EX、IFX14
--
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