我Intel又回來了 加入10nm手機芯混戰 - 3C

By Rebecca
at 2016-12-04T14:29
at 2016-12-04T14:29
Table of Contents
今年中旬傳出Intel退出智能手機市場的消息,就連最堅定的盟友華碩在今年發佈的
ZenFone手機上面也全面使用高通驍龍晶片。不過有消息稱,Intel並沒有完全放棄智能手
機市場這塊大肥肉,最快會在2018年重新回歸手機晶片市場。
該消息據說來自於英特爾前員工在 Linkedln上的爆料,可信性比較高。該員工聲稱
,Intel將於2018年發佈的這款移動晶片代號為Ice Lake,基於英特爾第二代10納米工藝
打造,採用最新的 GPU 和 CPU 架構,這些新技術能夠保證性能足夠強大的同時,能耗也
更低。
Ice Lake 晶片還將加入“Computer Vision”計算視覺引擎,加深對混合現實應用的
優化,其他一些技術還包括自動駕駛、 ADAS 以及專門加速語音識別的硬件等等。未來很
可能應用在微軟Surface手機上面。
http://digi.it.sohu.com/20161202/n474713083.shtml
--
ZenFone手機上面也全面使用高通驍龍晶片。不過有消息稱,Intel並沒有完全放棄智能手
機市場這塊大肥肉,最快會在2018年重新回歸手機晶片市場。
該消息據說來自於英特爾前員工在 Linkedln上的爆料,可信性比較高。該員工聲稱
,Intel將於2018年發佈的這款移動晶片代號為Ice Lake,基於英特爾第二代10納米工藝
打造,採用最新的 GPU 和 CPU 架構,這些新技術能夠保證性能足夠強大的同時,能耗也
更低。
Ice Lake 晶片還將加入“Computer Vision”計算視覺引擎,加深對混合現實應用的
優化,其他一些技術還包括自動駕駛、 ADAS 以及專門加速語音識別的硬件等等。未來很
可能應用在微軟Surface手機上面。
http://digi.it.sohu.com/20161202/n474713083.shtml
--
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