用料再進化-撼訊PowerColor R9 280 3GB - 3C

好讀網址: http://www.xfastest.com/thread-132867-1-1.html

前言:
AMD推出R9系列後相信很多人都知道很多產品是Rename而來的產物
當然這次小編要介紹的R9 280也不列外，R9 280核心其實是Radeon HD 7950
效能方面與前一代的Radeon HD 7950無太大差異
目前許多廠商都是直接換上較好的散熱系統
這次小編要介紹的撼訊PowerColor R9 280 3GB OC TurboDuo這張卡
在散熱上下了不少功夫，採用TurboDuo散熱技術，具備兩顆9公分大風扇並搭配專利GSG型
熱導管設計及大面積鋁製鰭片有效率地降低溫度，展現優於公版之23%散熱效能提升及15%
運行噪音降低之表現
而用料方面採用高規格黃金用料，其中包含多相供電設計、DirectFET和數位PWM，可大幅
提升整體超頻效能及穩定性
核心部分擁有1792個串流處理器，其核心時脈為855MHz，透過boost可達960MHz，並配備
3GB GDDR5記憶體及1250MHz記憶體時脈
現在就讓我們來看看PowerColor R9 280 3GB OC TurboDuo這張卡的表現如何!!!

http://www.xfastest.com/images/xftitle.png外包裝與外觀.配件

▼外包裝同樣採用透明簍空設計，背面系統環境要求與產品特色，強調TurboDuo散熱設計
可降低19%的噪音與提升23%的散熱能力，用料部分採用高規格黃金用料

http://www.xfastest.com/data/attachment/album/201404/13/001248oi8ides1n1lhccpw.jpg

http://www.xfastest.com/data/attachment/album/201404/13/001249gmg0ch4hdd41b62g.jpg

▼TurboDuo字樣很有立體感，採用透明塑膠突字與平面文字勾出立體感

http://www.xfastest.com/data/attachment/album/201404/13/001253cys816ctffpusfww.jpg

▼顯卡本體與配件:安裝手冊、驅動光碟、電源轉接頭

http://www.xfastest.com/data/attachment/album/201404/15/210701ha3qup77q3u784aq.jpg

▼顯示卡正反面一覽，正面導風罩採用金屬製品，散熱部分具備兩顆9公分大風扇並搭配
專利GSG型熱導管設計及大面積鋁製鰭片；背面搭配強化背板，可強化PCB板結構防止板彎
，從顯卡上與下方看過去，可看到非常粗勇的導熱管，顯卡本體占用2個Slot

http://www.xfastest.com/data/attachment/album/201404/13/001311s6dbbxnjdbcmczd6.jpg

http://www.xfastest.com/data/attachment/album/201404/13/001313yucc480707za8n7r.jpg

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▼輸出部分有mini Display Port*2、HDMI、DVI-I，有支援AMD Eyefinity但必須要使用1
組DP做搭配

http://www.xfastest.com/data/attachment/album/201404/13/001320m62929mo2g620v9b.jpg

http://www.xfastest.com/images/xftitle.png細部用料

▼背面有4顆螺絲與加強背板拆開後，正反面一覽

http://www.xfastest.com/data/attachment/album/201404/13/001322xe313ve0zcencvcs.jpg

http://www.xfastest.com/data/attachment/album/201404/13/001324l57nw9v9iggnu9ng.jpg

▼前半部用料一覽，在DVI-I Connector上可看到金屬殼做雜訊遮蔽，上方有CrossFire
金手指與UEFI VBIOS 切換

http://www.xfastest.com/data/attachment/album/201404/13/001328wlvc6jv1bbwjw4z4.jpg

▼晶片周邊配置一覽

http://www.xfastest.com/data/attachment/album/201404/13/001330up2gpygo121g2f18.jpg

▼後半部用料一覽，需要外接6pin+8pin 電源
電源用料採用5+1相供電，MOS部分採用CopperMOS，電容部分採用NCC日系電容，用料比前
一代Radeon HD 7950提升了不少

http://www.xfastest.com/data/attachment/album/201404/15/163251d4ksg4q5ksfi8ziv.jpg

http://www.xfastest.com/data/attachment/album/201404/13/001336t5ijcvaz5556xvjj.jpg

http://www.xfastest.com/data/attachment/album/201404/13/001347g282vnm99m89njni.jpg

▼PWM控制器ChiL CHL8228G搭配CHL8510 Mosfet Driver提供供電迴路

http://www.xfastest.com/data/attachment/album/201404/13/001344gui0ffbfg3urcbcc.jpg

http://www.xfastest.com/data/attachment/album/201404/13/001354vqmr53r4kz4no527.jpg

▼晶片後方背面放滿了電容

http://www.xfastest.com/data/attachment/album/201404/13/001326gxvzxwragtxfr5nc.jpg

▼記憶體部分採用SK Hynix H5GQ2H24AFR-R0C (運作時脈1600Mhz等效6G)GDDR5 12顆組成
3G容量

http://www.xfastest.com/data/attachment/album/201404/13/001403rqyyoyenzhsadco4.jpg

▼R9 280 核心晶片驗明正身

http://www.xfastest.com/data/attachment/album/201404/13/001359q570t75lgqu5gmug.jpg

http://www.xfastest.com/images/xftitle.png散熱模組
▼散熱模組一覽

http://www.xfastest.com/data/attachment/album/201404/13/001412r0135cyl3ndqzt11.jpg

▼風扇採用雙9公分散熱風扇並固定於散熱鰭片上

http://www.xfastest.com/data/attachment/album/201404/13/001415sgyncu8k2ntofqz7.jpg

▼風扇採用Power Logic製品PLD09210D12HH

http://www.xfastest.com/data/attachment/album/201404/13/001417eltxr7k10lrw0qnz.jpg

▼整體散熱部分為三之8mm熱導管，採用GSG型設計，故實際看到會有六個部分與散熱鰭片
做搭接，散熱表現更佳，從圖中可看到左右兩端末端處皆為貫穿散熱鰭片式設計，其他四
處皆為散熱鰭片折Fin方式設計

http://www.xfastest.com/data/attachment/album/201404/13/001419ggap63mcsca3j331.jpg

http://www.xfastest.com/data/attachment/album/201404/13/001420dued3cdad1wjumu3.jpg

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http://www.xfastest.com/data/attachment/album/201404/13/001423o2i2e7njffez4q2n.jpg

http://www.xfastest.com/images/xftitle.png[b][size=5]測試平台與環境
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測試平台
CPU:Intel i5-4670K @ 4.5GHz
Cooler: XIGMATEK GaiaII
MB: ASRock Z87 Extreme 4
RAM: Kingston HyperX Predator DDR3-2800 8G kit(4G*2)
VGA: PowerColor R9 280 3GB OC TurboDuo
Storage: SanDisk U100 128G
PSU: Steventeam 750W
OS: Windows 7 旗艦版 64 Bit

▼3DMark06:35014

http://www.xfastest.com/data/attachment/album/201404/13/001428t7q97q98yh2yzvlh.jpg

▼3DMark Vantage Performance Mode:P33295

http://www.xfastest.com/data/attachment/album/201404/13/001433nbi3xoh9wcl5b13r.jpg

▼3DMark Vantage Extreme Mode:X23434

http://www.xfastest.com/data/attachment/album/201404/13/001432qstzn3cs0v8fqsss.jpg

▼3DMark 11 Performance Mode:P9270

http://www.xfastest.com/data/attachment/album/201404/13/001429exxrxhpx2hqewx6e.jpg

▼3DMark 11 Extreme Mode:X2983

http://www.xfastest.com/data/attachment/album/201404/13/001428pi09iaiva4a9of94.jpg

▼3DMark 2013

http://www.xfastest.com/data/attachment/album/201404/13/001430zer67ovqr17qrqm5.jpg

▼3DMark 2013 Ice Storm Extreme:153158

http://www.xfastest.com/data/attachment/album/201404/13/001432f3jw10owz4lz41jb.jpg

▼3DMark 2013 Fire Strike Extreme:3243

http://www.xfastest.com/data/attachment/album/201404/13/001431sg9bvnbb9698lelk.jpg

▼CINEBENCH R11 X64:69.10 fps

http://www.xfastest.com/data/attachment/album/201404/13/001437jw4xve9x99herh0w.jpg

▼CINEBENCH R15 X64:155.26 fps

http://www.xfastest.com/data/attachment/album/201404/13/001438llfzzl0j2119u9kg.jpg

▼BIO5 1920x1080 DirectX 10 ARGB8 TestA:170.2 fps

http://www.xfastest.com/data/attachment/album/201404/13/001434s7v7vcvy7v976ywi.jpg

▼BIO5 1920x1080 DirectX 10 ARGB8 TestB:176.2 fps

http://www.xfastest.com/data/attachment/album/201404/13/001435l3h33zyc8zfe8tdf.jpg

▼BIO6 1920x1080 DirectX 9.0C ARGB8:9075

http://www.xfastest.com/data/attachment/album/201404/13/001436sihhebmzhnvgebin.jpg

▼DMC4 1920x1080 DirectX 10 A2RGB10

http://www.xfastest.com/data/attachment/album/201404/13/001439lworkqc6rjm2652l.jpg

▼FF IXV 1920x1080:6259

http://www.xfastest.com/data/attachment/album/201404/13/001440w2dfq8a7bykbmcmh.jpg

▼FF IXV(ONLINE)1920x1080:7690

http://www.xfastest.com/data/attachment/album/201404/13/001441zkggjkcuzuagjcz2.jpg

▼Heaven 1920x1080 8xAA

http://www.xfastest.com/data/attachment/album/201404/13/001443xj3y0a31yfxptcpt.jpg

▼LP2 1920x1080 DirectX 11 MSAA8X TestA:64.5 fps

http://www.xfastest.com/data/attachment/album/201404/13/001444s6oqb6ccbo8jgzdc.jpg

▼LP2 1920x1080 DirectX 11 MSAA8X TestB:62.3 fps

http://www.xfastest.com/data/attachment/album/201404/13/001445dg7t0t7pz804ti4l.jpg

▼SF IV 1920x1080 C16XQAA:13011

http://www.xfastest.com/data/attachment/album/201404/13/001446ufxpkbf9pbx8welp.jpg

▼TLR 1920x1080:178.32 fps

http://www.xfastest.com/data/attachment/album/201404/13/001447wx7gf09qp8gddlz7.jpg

▼FunMark燒機:最大溫度74度 風扇轉數61% 平均49fps

http://www.xfastest.com/data/attachment/album/201404/13/001442rkibjmidjbhr6rdb.jpg

http://www.xfastest.com/images/xftitle.png[b][size=5]BF4遊戲畫面順暢度測試
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▼BF4顯示設定

http://www.xfastest.com/data/attachment/album/201404/15/213017ca3o3d9xoz588op8.jpg
▼BF4畫面

http://www.xfastest.com/data/attachment/album/201404/15/213017czm48pjyjpznxfcr.jpg

http://www.xfastest.com/data/attachment/album/201404/15/213018o8h4g22yxmm0hh81.jpg

遊戲中順暢度相當不錯，fps都可以達到60張左右的表現，不會有lag的情形發生
整個遊戲過程風扇相當安靜，反而是遊戲過程中高頻音與電流聲相當惱人@@

http://www.xfastest.com/images/xftitle.png[b][size=5]總結[/size][/b]
這張撼訊PowerColor R9 280 3GB OC TurboDuo在用料上比上一代更下了不少功夫
電源方面採用高規格黃金用料，其中包含多相供電設計、DirectFET和數位PWM，可大幅提
升整體超頻效能及穩定性
散熱方面採用兩顆9公分大風扇並搭配專利GSG型熱導管設計及大面積鋁製鰭片有效率地降
低溫度，展現優於版之23%散熱效能提升及15%運行噪音降低之表現

使用FurMark燒機最高溫僅74度 且風扇聲音相當安靜!!
在測試過程中表現很不錯，效能達到一定的水準，且原廠預設含Boost功能效能比公版卡
表現更佳
許多遊戲都可以維持不錯的效能水準，已可滿足一般消費者在大部分遊戲的順暢度

美中不足的是在跑測試與遊戲過程中可明顯聽到高頻音與電流聲，聽久了有點不是很舒服
，這個部分就真的需要再改進了!!

整體來說這張顯示卡CP值不錯，撼訊原廠提供3年保固，在後續的維修與保固上有一定的
保障

以上~~感謝賞文^^謝謝大家

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